High Aspect Ratio Via Formation Technology
High-aspect-ratio via formation technology using glass resin substrate materials
This is a technology for forming build-up vias used in the production of high-frequency antenna patterns on printed circuit boards. While laser processing is commonly used for build-up vias, high-precision via formation using mechanical drilling and the developed high-aspect-ratio plating layer have enabled the formation of vias with a drill diameter of 0.15 mm and an interlayer distance of 0.6 mm, achieving a high aspect ratio of 4. This has made flexible antenna design for high-frequency antenna patterns possible.
- Company：ピーダブルビー 草津事業所
- Price：Other
